中文翻译与英英解释

【计算机】叩焊，(反装)晶片，倒装片(法)。

flip:    adj. (flipper, flippest) 〔美俚 ...

chip:    n. (摔跤时)用绊腿把对方摔倒的一种技巧。 vt. ( ...

Flip chip, also known as controlled collapse chip connection or its acronym, C4, is a method for interconnecting semiconductor devices, such as IC chips and microelectromechanical systems (MEMS), to external circuitry with solder bumps that have been deposited onto the chip pads. The solder bumps are deposited on the chip pads on the top side of the wafer during the final wafer processing step.

例句与用法

The reworkable underfills technology for flip chip
倒装芯片的可修复底部填充技术

Research on the thermode bonding procee for flip chip
倒装芯片热电极键合工艺研究

Implementation of flip chip and chip scale technology
叩焊晶片和晶片标度技术的执行

Flip chip will be a new method of packaging technology
倒装芯片将成为封装技术的最新手段

Bump fabrication methods for flip chip
倒装芯片凸点制作方法

Screen printing technology for solder ball flip chip for smt
倒装芯片及晶圆和基底凸起的网版印刷技术一

Flip chip bonding technology used in modern micro - photoelectron package
现代微光电子封装中的倒装焊技术

Fcpga flip chip pin grid array
反转芯片针脚栅格阵列

Fcpga flip chip pin grid array
反转芯片针脚栅格阵列

Flip chip underfill technology
的芯片倒装技术